1. Product Overview

2. Main Technical Parameters

3. Product Features

• High Stability and High Precision: Optimized for high-end thin film processing technologies, the equipment delivers continuous and stable power output to meet strict industrial precision requirements.
• Fast Arc Extinguishing Performance: Effectively optimizes the coating process accuracy and avoids product scrapping caused by unstable plasma operation, greatly improving production yield.
• Modular Design: Adopts a standardized modular structure, which simplifies daily maintenance, component replacement and equipment function upgrade.
• Impedance Matching Function: Compatible with PFM series matching boxes. It can automatically adjust impedance parameters to reduce reflected power and improve power utilization efficiency.
• Intelligent Protection System: Equipped with comprehensive protection mechanisms including overload protection, undervoltage protection, under-current protection and continuous over-temperature control to ensure safe and stable operation.
• User-Friendly Interface: Supports graphical parameter display with intuitive data presentation and simple operation, lowering the threshold for equipment operation.

4. Structure and Composition

4.1 RF Power Supply System Working Structure

4.2 Core Components

• Control and Excitation Module: Responsible for signal generation, parameter control and driving signal output.
• Power Amplification Module: Composed of multi-channel parallel amplifiers to achieve stable power amplification output.
• Output Synthesis Module: Completes signal synthesis, filtering and output calibration to ensure stable RF signal quality.
• Feedback Module: Real-time detection of forward and reverse power, realizing closed-loop power regulation and control.
• Optional Matching Box: PFM series matching box for automatic impedance matching and power loss reduction.

5. Application Fields

• Semiconductor Manufacturing: Wafer processing, thin film deposition, etching process production
• Magnetron Sputtering Coating: Thin film deposition of metal, ceramic and various composite materials
• Ion Implantation: Semiconductor doping process and material surface modification treatment
• Induction Heating: Industrial metal heating, thermal processing and forming applications
• Vacuum Thin Film Industry: All kinds of vacuum coating and thin film preparation processes
• Flat Panel Display Industry: Thin film transistor manufacturing and display screen coating processing
• Photovoltaic Industry: Solar cell thin film deposition and photovoltaic module manufacturing
• Scientific Research and Education: Plasma physics research, laboratory experiments and professional teaching

6. Installation Requirements

6.1 Power Connection Inspection

• Ensure that the power plug is firmly and completely inserted into the power socket.
• Inspect the power cord for damage, aging or breakage.
• Confirm smooth power circuit without short circuit or open circuit faults.

6.2 Environmental Requirements

• Arrange installation location with appropriate temperature and humidity conditions.
• Ensure unobstructed ventilation for heat dissipation.
• Keep away from strong electromagnetic interference sources to avoid signal abnormality.

6.3 Grounding Requirements

• Implement reliable equipment grounding to guarantee operational safety.
• Comply with national and industrial electrical safety standards for grounding specifications.

6.4 Space Layout Requirements

• Reserve sufficient surrounding space for equipment heat dissipation.
• Ensure convenient access for daily operation, inspection and maintenance.